Business

Mobile & Display Products

  • EMI Shielding Tape
  • Heat Spread Tape
  • Electro-conductive Fabric Tape (Single/Double)
  • Heat Responsive Tape (Re-workable)
  • PU Foam Sponge, Cell Pad

EMI Shielding Tape

  • To use

    • Blocking electromagnetic interference between major components to maintain the performance of each component and prevent malfunction/functional degradation
  • Advantage

    • Excellent electromagnetic wave shielding performance and grounding effect
    • Flexibility of product, providing strong adhesion to curved spaces and advantage for blanking workability
    • Composite materials of various thickness and types, easy to choose according to the needs of customers

Product Structure

  • Black Printed Layer
  • Conductive Woven / Non-Woven
  • Conductive Adhesive
  • Release Liner
  • Black Printed Layer / Black Printed PET
  • Conductive Metal(Cu / Al)
  • Conductive Adhesive
  • Release Liner

Application Fields

  • Parts which require EMI shielding & grounding
  • IC Chip(Cover-IC), FPCB, Antenna, etc.

※ OLED module applied, heat dissipation metal tape(Cu)

Heat Spread Tape

  • To use

    • Heat dissipation to prevent damage to electronic devices exposed to heat
  • Advantage

    • Excellent heat dissipation: Various thickness and types by metal, advantageous for heat conductivity
    • Retention of uniform adhesive properties even at high temperatures
    • Air-pass performance delivered through the adhesive layer adopting the Embo pattern in case of adhesion to large area

Product Structure

  • Conductive Metal (Cu / AL)
  • Conductive / Non-Conductive Adhesive
  • Release Liner
  • Nickel Layer (Ni)
  • Conductive Metal(Cu)
  • Conductive Adhesive
  • Release Liner (with Embo pattern)

Application Fields

  • Parts requiring the dissipation and diffusion of intensive heating
  • OLED Display Module (Cover-Panel), AP, IC Chipset

※ Conductive fabric double-sided tape for PBA

Electro-conductive Fabric Tape (Single/Double)

  • To use

    • EMI shielding, grounding, and parts fixing
  • Advantage

    • Uninform surface resistance: Plating of conductive fabric substrate, and conductive beads distributed uniformly in adhesives
    • Powerful adhesion at room temperature and low temperature (improvement of joint phenomenon on substrate surface at low temperature)
    • Various thickness of adhesive layer (0.02 ~ 0.30mm)

Product Structure

  • Release Liner
  • Conductive Adhesive
  • Conductive Fabric
  • Conductive Adhesive
  • Release Liner
  • PU Skin
  • Conductive Fabric
  • Conductive Adhesive
  • Release Liner

Application Fields

  • Parts which require EMI shielding & grounding
  • FPCB, Cam Deco, Side Key (Sub-PBA)

Heat Responsive Tape (Re-workable)

  • To use

    • Easy separation of parts at high temperatures / reworkable functional adhesive tape(rework tape)
  • Advantage

    • Low adhesion for rework in high temperature section (specialized adhesion when heat is applied at 70℃ for 15 min: 150~250 gf/in)
    • Retention of powerful adhesion at room temperature and low temperature (particularly, PSA viscosity is preserved even at low temperatures)

Product Structure

  • Release Liner
  • HR Adhesive
  • PET / Cu
  • Normal Adhesive
  • Release Liner

Changes in HR tape adhesion by temperature section

Application Fields

  • Parts to be disassembled and reworked by applying heat
  • Separation and reattachment of display module and chassis/apparatus

PU Foam Sponge, Cell Pad

  • To use

    • Protection of major parts from external shock; compensation of height difference through compression/recovery; and reduction of vibration/noise
  • Advantage

    • Layer suited for various purposes(1 layer to 3 layers); fire retardant performance(UL94 HBF)
    • Adjustment of shock absorption rate through diversification of density(density: 0.18 ~ 0.7g/m²)
    • Adjustment in a way that suits the properties of adherent (compression recovery rate: slow/normal/fast)

Product Structure

Please slide the table to check.

Classification Foam
(1 Layer)
PET integrated type
(2 Layer)
Adhesion integrated way
(3 Layer)
Skin integrated type
(2 Layer)
Light-shielding
integrated type
(3 Layer)
Structure
PU Foam (Cell Pad) PU Foam PU Foam PU Foam Black PET
PET PU Foam
PET Adhesion(PSA) Skin Skin
Thickness (mm) 0.1 ~ 3.0 0.15 ~ 3.0 0.1 ~ 4.5 0.1 ~ 3.0 0.2 ~ 3.0
Application Fields Mass production of secondary batteries is in progress Mass production of smartphones is in progress Mass production of foldable phones is in progress Mass production of monitors/TVs is in progress Mass production of monitors/TVs is in progress